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IEEE Spectrum — AI
4 min read
Why Thermal Metrology Must Evolve for Next-Generation Semiconductors
An in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement — and what advanced metrology must deliver. What Attendees will Learn Why heat is now the dominant constraint on semiconductor scaling — Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted the primary bottleneck from lithography to thermal management,…